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The exhaustive list of topics in Electronics Systems Packaging in which we provide Help with Homework Assignment and Help with Project is as follows:

  • Electronic systems packaging:
    • Semiconductors.
    • Products and levels of packaging.
    • Packaging aspects of handheld products.
  • Semiconductor Packaging:
    • Semiconductor and Process flowchart.
    • Wafer fabrication, inspection and testing.
    • Wafer packaging; Packaging evolution.
    • Wire bonding.
  • Semiconductor Packages:
    • Commonly used packages and advanced packages; Materials in packages.
    • Thermal mismatch in packages; Current trends in packaging.
    • Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps; Hybrid circuits.
  • Electrical Design considerations in systems packaging:
    • Resistive Parasitic.
    • Capacitive and Inductive Parasitic.
    • Layout guidelines and the Reflection problem.
    • Interconnection.
  • CAD for Printed Wiring Boards:
    • Benefits from CAD; Introduction to DFM, DFR & DFT.
    • Components of a CAD package and its highlights.
    • Design Flow considerations; Beginning a circuit design with schematic work and component layout.
    • Demo and examples of layout and routing; Technology file generation from CAD; DFM check list and design rules; Design for Reliability.
  • Printed Wiring Board Technologies:
    • CAD output files for PCB fabrication; Photo plotting and mask generation.
    • Process flow-chart; Vias; PWB substrates.
    • Substrates continued; Video highlights; Surface preparation.
    • Photoresist and application methods; UV exposure and developing; Printing technologies for PWBs.
    • PWB etching; Resist stripping; Screen-printing technology.
    • Through-hole manufacture process steps; Panel and pattern plating methods.
    • Video highlights on manufacturing; Solder mask for PWBs; Multilayer PWBs; microvias.
    • Microvia technology and Sequential build-up technology process flow for high-density interconnects.
    • Conventional Vs HDI technologies; Flexible circuits.
  • Surface Mount Technology:
    • SMD benefits; Design issues; Introduction to soldering.
    • Reflow and Wave Soldering methods to attach SMDs.
    • Solders; Wetting of solders; Flux and its properties; Defects in wave soldering.
    • Vapour phase soldering, BGA soldering and Desoldering/Repair; SMT failures.
    • SMT failure library and Tin Whiskers.
    • Tin-lead and lead-free solders; Phase diagrams; Thermal profiles for reflow soldering; Lead-free alloys.
    • Lead-free solder considerations; Green electronics; RoHS compliance and  e-waste recycling issues.
  • Thermal Design considerations in systems packaging:
    • Thermal Design considerations in systems packaging.
  • Embedded Passives Technology:
    • Embedded passives; Need for embedded passives; Design Library; Embedded resistor processes.
    • Embedded capacitors; Processes for embedding capacitors; Case study examples; Summary of materials in packaging.