+1 678 648 4277 

Electronics system packaging homework help at an affordable price

We offer original, high-quality, and timely electronics system packaging homework help on a 24/7 basis to students from all corners of the world. We have been in the industry for many decades, and therefore we know what it takes to produce high-quality solutions at an affordable price. Hire our online electronics system packaging assignment helpers and get your assignment solutions delivered to you on time. We are always willing to share a sample of our previous works should you wish to have a pre-look at the type of homework help solutions you would expect whenever you hire us.

The exhaustive list of topics in Electronics Systems Packaging in which we provide Help with Homework Assignment and Help with Project is as follows:

  • Electronic systems packaging:
    • Semiconductors.
    • Products and levels of packaging.
    • Packaging aspects of handheld products.
  • Semiconductor Packaging:
    • Semiconductor and Process flowchart.
    • Wafer fabrication, inspection and testing.
    • Wafer packaging; Packaging evolution.
    • Wire bonding.
  • Semiconductor Packages:
    • Commonly used packages and advanced packages; Materials in packages.
    • Thermal mismatch in packages; Current trends in packaging.
    • Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps; Hybrid circuits.
  • Electrical Design considerations in systems packaging:
    • Resistive Parasitic.
    • Capacitive and Inductive Parasitic.
    • Layout guidelines and the Reflection problem.
    • Interconnection.
  • CAD for Printed Wiring Boards:
    • Benefits from CAD; Introduction to DFM, DFR & DFT.
    • Components of a CAD package and its highlights.
    • Design Flow considerations; Beginning a circuit design with schematic work and component layout.
    • Demo and examples of layout and routing; Technology file generation from CAD; DFM check list and design rules; Design for Reliability.
  • Printed Wiring Board Technologies:
    • CAD output files for PCB fabrication; Photo plotting and mask generation.
    • Process flow-chart; Vias; PWB substrates.
    • Substrates continued; Video highlights; Surface preparation.
    • Photoresist and application methods; UV exposure and developing; Printing technologies for PWBs.
    • PWB etching; Resist stripping; Screen-printing technology.
    • Through-hole manufacture process steps; Panel and pattern plating methods.
    • Video highlights on manufacturing; Solder mask for PWBs; Multilayer PWBs; microvias.
    • Microvia technology and Sequential build-up technology process flow for high-density interconnects.
    • Conventional Vs HDI technologies; Flexible circuits.
  • Surface Mount Technology:
    • SMD benefits; Design issues; Introduction to soldering.
    • Reflow and Wave Soldering methods to attach SMDs.
    • Solders; Wetting of solders; Flux and its properties; Defects in wave soldering.
    • Vapour phase soldering, BGA soldering and Desoldering/Repair; SMT failures.
    • SMT failure library and Tin Whiskers.
    • Tin-lead and lead-free solders; Phase diagrams; Thermal profiles for reflow soldering; Lead-free alloys.
    • Lead-free solder considerations; Green electronics; RoHS compliance and  e-waste recycling issues.
  • Thermal Design considerations in systems packaging:
    • Thermal Design considerations in systems packaging.
  • Embedded Passives Technology:
    • Embedded passives; Need for embedded passives; Design Library; Embedded resistor processes.
    • Embedded capacitors; Processes for embedding capacitors; Case study examples; Summary of materials in packaging.