The exhaustive list of topics in Micro And Smart Systems in which we provide Help with Homework Assignment and Help with Project is as follows:
- Micro and Smart Systems.
- Scaling effects.
- Microsensors.
- Microactuators.
- Microsystems.
- Structure of silicon and other materials.
- Silicon wafer processing.
- Thin-film deposition.
- Lithography.
- Wet etching.
- Dry etching.
- Bulk micromachining.
- Surface micromachining.
- Wafer-bonding.
- LIGA.
- Moulding techniques.
- Soft lithography.
- Polymer processing.
- Thick-film processing.
- Low temperature co-fired ceramic processing.
- Smart material processing.
- Stresses and deformation:
- Bars.
- Beams.
- Microdevice suspensions:
- Lumped modeling.
- Residual stress.
- Stress gradients.
- Poisson effect.
- Anticlastic curvature.
- Examples of micromechanical structures.
- Thermal loading.
- Bimorph effect.
- Dealing with large displacements.
- In-plane and 3D elasticity equations.
- Vibrations of bars and beams.
- Gyroscopic effect.
- Frequency response.
- Damping.
- Quality factor.
- Micro-flows for damping calculation.
- Types of numerical methods for solving partial differential equations.
- Weak form.
- Shape functions.
- Isoparametric formulation.
- Numerical integration.
- Implementation of the finite element method.
- FEM for piezoelectrics.
- Semiconductor devices.
- OpAms.
- OpAmp circuits.
- Signal conditioning for microsystems devices.
- Control and Microsystems.
- Vibration control of a beam.
- Integration of Microsystems.
- Microelectronics.
- Packaging of Microsystems.
- Flip-chip.
- Ballgrid.